Products

Details

The silicone SIM card slot tray holder is designed for precision consumer electronics applications requiring waterproof sealing, shock resistance, and long-term durability. Manufactured through advanced liquid silicone rubber (LSR) injection overmolding technology, the product combines the flexibility of silicone with the structural stability of plastic or metal substrates.

The overmolding process allows the liquid silicone to bond precisely with the insert structure, creating a compact and highly reliable integrated component. Compared with traditional assembly methods, LSR overmolding improves waterproof capability, assembly consistency, and product lifespan while reducing secondary assembly operations.

Mold Design & Technology

Precision LSR Overmolding Technology

The mold adopts advanced liquid silicone overmolding technology to accurately combine LSR with plastic or metal inserts, ensuring strong adhesion, excellent sealing performance, and stable product quality.

Cold Runner System for Material Saving

A precision cold runner system keeps the liquid silicone material at controlled temperatures before entering the cavity, reducing material waste and improving molding consistency during high-volume production.

High-Precision Insert Positioning

The mold is engineered with precise insert locating structures to ensure accurate positioning of SIM tray substrates during injection molding. This guarantees tight dimensional tolerances and stable assembly performance.

Flash-Free Micro Part Molding

Optimized cavity design and precision machining technology help achieve flash-free molding for small electronic sealing components, reducing secondary trimming processes and improving production efficiency.

Waterproof Sealing Structure Design

Special sealing geometry and silicone compression structures are integrated into the mold design to help achieve reliable waterproof and dustproof performance required for IP67/IP68 electronic products.

Automation Integration

The mold can be integrated with robotic arms and automatic demolding systems, supporting fully automated production lines for consumer electronic silicone components. Automated insert loading and part removal improve productivity and reduce labor costs.

Durable Mold Structure and Long Service Life

Manufactured with premium mold steel and optimized thermal control channels, the mold provides stable long-term production performance and extended service life under continuous mass production conditions.

FAQ

Q: What materials can be used for the insert part?

A: The insert can be made from plastic, stainless steel, aluminum alloy, or other engineering materials depending on the product application and sealing requirements.

Q: What are the advantages of LSR overmolding for SIM card tray holders?

A: LSR overmolding provides excellent waterproof sealing, shock absorption, flexibility, dimensional accuracy, and long-term durability for electronic components.

Q: Can the mold support IP67 or IP68 waterproof products?

A: Yes. The mold can be designed with precision sealing structures suitable for manufacturing waterproof SIM tray components for IP67/IP68 electronic devices.

Q: Is automatic production available?

A: Yes. The mold is compatible with fully automatic vertical LSR injection molding machines, robotic arms, and automated demolding systems for efficient mass production.

Q: What industries commonly use LSR overmolding technology?

A: LSR overmolding is widely used in consumer electronics, automotive connectors, medical devices, wearable products, and industrial sealing applications.

Q: Can customized mold solutions be provided?

A: Yes. Customized cavity layouts, product dimensions, runner systems, and automation solutions can be developed according to customer requirements and production capacity needs.